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Nov 25, 2017 当研究室の論文がAsian J.
Welcome to the boundary domain of Mechanical Engineering and Chemistry.
世界初 3-ヘキシルチオフェンと塩化鉄微粒子の酸化重合系反応機構を解明 - 有機半導体高分子の低コスト創造プロセスに期待 -.
압출공정 기반 전자파 차폐소재 및 50dB급 일체형 필름 제조공정 기술개발.
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Adhesion Associates are consultants in Composite and Adhesive Bonding Technology, specialising in bonded repairs for metallic structures and bond failure forensics. Design methods for adhesive bonded joints. Design methods for adhesive bonded repairs to metallic structures.